Table of Contents
Sandwich and thermal contact resistance
These are special connector elements that can only be used for heat transfer computations. Nodes located at the connection point must be duplicated.
Each connector element is described in the name.i1 file using one CN batch:
CN T INDF E IE IE$_1$ ID$_1$ IE$_2$ ID$_2$
| $\mathtt{INDF}$ | The identification number of the connection type. | |
|---|---|---|
| $=-1$ | sandwich, see the Reference Manual | |
| $=-6$ | thermal contact resistance, see the Reference Manual | |
| $\mathtt{IE}$ | The number of the connector element, see below. | |
| $\mathtt{IE}_1,\mathtt{IE}_2$ | The numbers of the connected elements. | |
| $\mathtt{ID}_1,\mathtt{ID}_2$ | The specification of the attachment location in the connected elements. | |
Sandwich
It is used to model a perfect surface thermal connection between semi-loof elements. The number of the connector element must be higher than the numbers of the connected semi-loof elements.
$\mathtt{ID}_1=\mathtt{ID}_2=1$.
Thermal contact resistance
It is used to model thermal contact resistance between isoparametric elements $\mathtt{ITE}=55$ or $56$.
$\mathtt{ID}_1,\mathtt{ID}_2$ specify the local face numbers $\mathtt{IS}_1,\mathtt{IS}_2$, between which the thermal contact resistance is to be inserted.